PRODUCTS & SERVICES

Surface Mounting
Box Build
Assembly & Soldering
Component Preparation
Engineering Services

Our SMT capabilities include both semi-automatic and fully automatic solder paste screening for medium to high volume requirements.

Our in-line layout of component placement equipment, conveyor and solder reflow system is an efficient and cost effective solution for your surface mounting requirements.

Placement capability ranges from high speeds for chip components to vision placement of fine pitch ICs.

High volume axial through-hole capabilities are available with cost-effective automatic insertion. We can auto-insert virtually any size pc board or panel up to 18” square.